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| To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein. 2SC5554 Silicon NPN Epitaxial VHF / UHF wide band amplifier ADE-208-692 (Z) 1st. Edition Nov. 1998 Features * Super compact package; (1.4 x 0.8 x 0.59mm) * Capable low voltage operation ; (V CE = 1V) Outline MFPAK 3 1 2 1. Emitter 2. Base 3. Collector Note: Marking is "YH-". 2SC5554 Absolute Maximum Ratings (Ta = 25C) Item Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current Collector power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC Pc Tj Tstg Ratings 15 9 1.5 20 80 150 -55 to +150 Unit V V V mA mW C C Electrical Characteristics (Ta = 25C) Item Collector cutoff current Collector cutoff current Emitter cutoff current DC current transfer ratio Collector output capacitance Symbol I CBO I CEO I EBO hFE Cob Min -- -- -- 50 -- Typ -- -- -- 120 0.6 Max 10 1 10 250 0.9 Unit A mA A V pF Test Conditions VCB = 15V , IE = 0 VCE = 9V , RBE = VEB = 1.5V , IC = 0 VCE = 1V , IC = 5mA VCB = 1V , IE = 0 f = 1MHz Gain bandwidth product Power gain fT PG 3.5 9 7 12 -- -- GHz dB VCE = 1V , IC = 5mA VCE = 1V, IC = 5mA f = 900MHz Noise figure NF -- 1.4 3 dB VCE = 1V, IC = 5mA f = 900MHz 2SC5554 Maximum Collector Dissipation Curve Collector Power Dissipation Pc (mW) 160 DC Current Transfer Ratio h FE 200 DC Current Transfer Ratio vs. Collector Current VCE = 1 V 120 80 100 40 0 0 50 100 150 200 1 2 5 10 20 50 100 Ambient Temperature Ta (C) Collector Current I C (mA) (pF) 1.0 Collector Output Capacitance vs. Collector to Base Voltage Gain Bandwidth Product f T (GHz) IE = 0 f = 1MHz 10 Gain Bandwidth Product vs. Collector Current VCE = 1 V Collector Output Capacitance Cob 0.8 8 0.6 6 4 0.4 0.2 2 0 0.1 0 1 2 5 10 20 50 100 0.2 0.5 1 2 5 10 Collector to Base Voltage V CB (V) Collector Current I C (mA) 2SC5554 Power Gain vs. Collector Current 20 VCE = 1 V 16 Power Gain PG (dB) f = 900MHz Noise Figure NF (dB) 4 5 VCE = 1 V f = 900MHz Noise Figure vs. Collector Current 12 3 8 2 4 1 0 1 0 2 5 10 20 50 100 1 2 5 10 20 50 100 Collector Current I C (mA) Collector Current I C (mA) 20 S21 Parameter vs. Collector Current VCE = 1 V S21 parameter |S 21| 2 (dB) 16 f = 1GHz 12 8 4 0 1 2 5 10 20 50 100 Collector Current I C (mA) 2SC5554 S11 Parameter vs. Frequency .8 .6 .4 3 .2 4 5 10 0 .2 .4 .6 .8 1 1.5 2 3 45 10 -10 -.2 -5 -4 -3 -.4 -.6 -.8 -1.5 -2 -120 -90 -60 -1 180 0 150 30 1 1.5 2 S21 Parameter vs. Frequency 90 120 Scale: 4 / div. 60 -150 -30 Condition : V CE = 1 V , I C = 5mA 100 to 2000 MHz (100 MHz step) Condition : V CE = 1 V , I C = 5mA 100 to 2000 MHz (100 MHz step) S12 Parameter vs. Frequency 90 120 S22 Parameter vs. Frequency .8 .6 .4 3 1 1.5 2 Scale: 0.04 / div. 60 150 30 .2 4 5 10 180 0 0 .2 .4 .6 .8 1 1.5 2 3 45 10 -10 -.2 -150 -30 -.4 -120 -90 -60 -.6 -.8 -1.5 -2 -1 -5 -4 -3 Condition : V CE = 1 V , I C = 5mA 100 to 2000 MHz (100 MHz step) Condition : V CE = 1 V , I C = 5mA 100 to 2000 MHz (100 MHz step) 2SC5554 Sparameter (VCE = 1V, IC = 5mA, Zo = 50) S11 f (MHz) MAG 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 0.715 0.647 0.559 0.501 0.453 0.416 0.393 0.378 0.369 0.357 0.361 0.358 0.358 0.362 0.362 0.369 0.373 0.377 0.388 0.395 ANG -25.4 -50.1 -71.5 -88.2 -102.5 -114.8 -125.4 -134.4 -142.8 -149.5 -156.6 -162.2 -167.5 -172.5 -177.3 178.8 174.7 171.1 168.3 165.3 S21 MAG 13.06 11.47 9.74 8.28 7.08 6.16 5.43 4.84 4.37 3.99 3.66 3.38 3.15 2.96 2.78 2.64 2.50 2.38 2.28 2.18 ANG 161.3 144.2 131.0 121.3 113.7 108.1 103.1 99.3 95.7 92.5 89.7 87.2 84.9 82.7 80.9 78.6 77.2 75.1 73.3 71.8 S12 MAG 0.0279 0.0517 0.0681 0.0798 0.0882 0.0955 0.102 0.109 0.115 0.122 0.128 0.135 0.141 0.148 0.155 0.163 0.169 0.177 0.183 0.191 ANG 76.6 65.6 58.4 54.6 52.4 51.8 51.7 52.1 52.7 53.5 54.2 55.1 56.0 56.9 57.2 58.1 58.8 59.2 59.6 60.1 S22 MAG 0.947 0.828 0.697 0.587 0.501 0.433 0.378 0.333 0.295 0.266 0.240 0.217 0.199 0.180 0.166 0.151 0.137 0.126 0.113 0.102 ANG -16.1 -30.2 -40.4 -47.0 -51.3 -54.3 -56.2 -57.3 -58.0 -58.4 -58.6 -58.5 -58.0 -58.0 -57.2 -56.9 -56.6 -56.4 -56.2 -55.7 2SC5554 Package Dimensions Unit: mm 1.4 0.05 0.2 0.6 max. 0.2 + 0.1 - 0.05 0.15 - 0.05 + 0.1 3 1.2 0.05 0.8 0.1 2 0.2 - 0.05 0.45 0.45 + 0.1 1 0.2 - 0.05 0.2 0.6 max. + 0.1 0.9 0.1 Hitachi Code EIAJ JEDEC MFPAK -- -- 0.1 0.1 2SC5554 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Hitachi Semiconductor (America) Inc. 2000 Sierra Point Parkway Brisbane, CA 94005-1897 Tel: <1> (800) 285-1601 Fax: <1> (303) 297-0447 Copyright (c) Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. |
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